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Electrical Slip Rings for Semiconductor Equipment

2026-01-21

Latest company case about Electrical Slip Rings for Semiconductor Equipment

Electrical slip rings are high-end precision rotating core components for semiconductor equipment, specifically engineered for automated production, high-precision, and high-reliability operating conditions in the semiconductor industry. Under continuous 360° unrestricted rotation, it ensures stable transmission of power, encoder signals, and various sensitive signals. Designed with central through-holes and optional pneumatic or hydraulic rotary joints, it enables seamless transmission of electricity, signals, gas, and liquid. This integrated solution supports a wide range of semiconductor equipment throughout wafer processing, packaging, testing, and automation stages.

 

 

Core Applications Across the Semiconductor Production Process

 

Electrical slip rings are widely applied across the complete production process of semiconductor wafer manufacturing, chip packaging, and finished product testing, and are well suited for the rotating mechanisms of key semiconductor equipment.

 

Key Applications:

 

1. Front-End Wafer Manufacturing


Used in equipment such as photoresist coaters and developers, etching machines, PVD/CVD thin-film deposition systems, and CMP machines. Ideal for rotating chucks, target stages, or polishing heads, with through-holes for wafer carriers, vacuum lines, and gas pipelines.

 

2. Back-End Packaging and Testing


Applicable to wafer dicing, die bonding, wire bonding, and molding machines. Supports rotating indexing tables and pick-and-place mechanisms, with through-holes for vacuum lines and testing or drive cables.

 

3. Full-Process Inspection & Sorting


For wafer probers, chip visual inspection systems, and electrical test equipment. Ensures high-fidelity signal transmission in rotary worktables or gimbal systems, with through-holes for lens focusing shafts or probe drives.

 

4. Automation & Auxiliary Equipment


Used in wafer AGV rotary lifts, production line robots, and FOUP handling systems. Supports compact integration in rotary joints and loading platforms for seamless power, signal, and fluid transmission.